| 摘要 |
A boost power module and an inverter form a semiconductor module. A smoothing capacitor is arranged outside the semiconductor module. A bus bar forming a power supply line is divided into bus bars, between which a lead member extending outward from the semiconductor module is coupled. The lead member has an electric contact with one of terminals of the capacitor arranged outside the semiconductor module. A bus bar forming an earth line is divided into bus bars, between which a lead member extending outward from the semiconductor module is coupled. The lead member has an electric contact with the other terminal of capacitor. |
