发明名称 High aspect ratio openings
摘要 A capacitor forming method includes forming an electrically conductive support material over a substrate, with the support material containing at least 25 at % carbon. The method includes forming an opening through at least the support material where the opening has an aspect ratio of at least 20:1 within a thickness of the support material. After forming the opening, the method includes processing the support material to effect a reduction in conductivity, and forming a capacitor structure in the opening.
申请公布号 US8274777(B2) 申请公布日期 2012.09.25
申请号 US20080099577 申请日期 2008.04.08
申请人 KIEHLBAUCH MARK W.;MICRON TECHNOLOGY, INC. 发明人 KIEHLBAUCH MARK W.
分类号 H01G4/00 主分类号 H01G4/00
代理机构 代理人
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