LIGHT EMITTING DEVICE MODULE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A light emitting device module and a manufacturing method thereof are provided to form a heat emitting via in a device mounting area of a circuit substrate, thereby efficiently emitting heat generated from a plurality of light emitting devices. CONSTITUTION: A circuit substrate(110) includes a plurality of heat emitting vias(111~114). The vias are exposed on an upper side and a lower side of a device mounting area. A plurality of first heat emitting pads is bonded on the upper side of the device mounting area. The first heat emitting pads are connected to the heat emitting vias. A plurality of light emitting devices is mounted on the first heat emitting pads. A plurality of electrode pads(132) is bonded on the upper side of an electrode arranging area. A plurality of wires electrically connects the light emitting devices to the electrode pads.