ULTRA HIGH FREQUENCY PACKAGE MODULES

摘要

PURPOSE: An ultra high frequency package module is provided to prevent interference between antenna units and signal wires by separately arranging one second substrate equipped with one antenna unit on a first substrate in a lattice form. CONSTITUTION: A first substrate(20) is made of a low dielectric. A second substrate(30) is made of a high dielectric. The first substrate includes an RFIC(Radio Frequency Integrated Circuit)(50) in order to be electrically connected to an antenna unit(40). A connection unit(31) is formed on a lower portion of the second substrate in order to be electrically connected to a signal wire(22) of the first substrate. The antenna unit comprises an antenna, an antenna array, and antenna components.