发明名称 Improved plating method
摘要 <p>Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.</p>
申请公布号 KR101185194(B1) 申请公布日期 2012.09.24
申请号 KR20050033996 申请日期 2005.04.25
申请人 发明人
分类号 C25D5/00;C25D7/00;C25D5/18;C25D21/12;H05K3/42;H05K3/46 主分类号 C25D5/00
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