发明名称 LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
摘要 <p>A laser machining method includes directing pulse laser light onto a surface of a brittle material substrate, and a laser light scanning step for scanning laser light along a scribe-scheduled line. The laser intensity of the pulse laser light is 1.0 × 10 8 W/cm 2 or greater and 1.0 × 10 10 W/cm 2 or less. The value obtained by multiplying the amount of heat input (J/cm 2 ) by the linear expansion coefficient (10 -7 /K) of the brittle material is in a range of 3000 or greater and 100000 or less. Furthermore, the number of pulses within a square circumscribing the condensed light diameter of the pulse laser light is two or greater.</p>
申请公布号 KR101184259(B1) 申请公布日期 2012.09.21
申请号 KR20100039844 申请日期 2010.04.29
申请人 发明人
分类号 B23K26/36;B23K26/06;C03B33/09;H01S3/10 主分类号 B23K26/36
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