ELECTRIC JOINT STRUCTURE, AND METHOD FOR PREPARING THE SAME

摘要

PURPOSE: An electric connection terminal structure and a manufacturing method thereof are provided to improve shock resistance by suppressing a P-enriched layer and a Ni-Sn based intermetallic compound in a solder junction interface. CONSTITUTION: A non-electrolytic surface process plating layer including nickel is formed on a connection terminal. A solder layer(120) is formed on the non-electrolytic surface process plating layer. An intermetallic compound(150) is generated from the non-electrolytic surface process plating layer. The non-electrolytic surface process plating layer includes a nickel plating film of 0.02 to 1 um. The intermetallic compound is made of Cu-Sn-Pd-Ni.