| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that, since a shading member, a light reflection material, a coating member, an absorption member or an absorptive layer on a light-emitting diode element used for light control are subjected to high temperature exceeding 100°C at a turn-on time of the light-emitting diode element, heat resistant materials, e.g., ceramic, metal, etc., are used for those materials, which incurs a rise in manufacturing cost, and that, since the materials on the light-emitting diode element need to be formed to suit the shape of each light-emitting diode element, they cannot be used for other light-emitting diode elements. <P>SOLUTION: A light-emitting diode element 2 is mounted on a wiring board 1 ((A) in Fig. 2). Next, a silicone resin layer 3 consisting of YAG-containing dimethyl silicone is formed on top of the light-emitting diode element 2 as a wavelength conversion material (phosphor) by coating application or by mask printing ((B) in Fig. 2). Finally, the silicone resin layer 3 is discolored by irradiating laser to form a discolored portion X. This discolored portion X forms a shading part to exert light control. <P>COPYRIGHT: (C)2012,JPO&INPIT |
