发明名称 CURVED SURFACE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a curved surface substrate and method for manufacturing the same, capable of concurrently achieving high pattern accuracy and high productivity. <P>SOLUTION: The present invention is of a spherical shape having a first surface and a second surface, and includes a dielectric substance (1) in which an irregular section is formed on at least either one of the first surface and the second surface, and a conductor (2) provided in a recessed portion formed on the dielectric substance (1). Thus, a process requiring time is limited to only a molding manufacturing process by machining for reduction in the time required for a manufacturing process for a curved surface substrate, thereby concurrently achieving high pattern accuracy and high productivity. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012182353(A) 申请公布日期 2012.09.20
申请号 JP20110044961 申请日期 2011.03.02
申请人 MITSUBISHI ELECTRIC CORP 发明人 SAMEJIMA SOHEI;TAKEYA HAJIME;MATSUMOTO MICHIHITO
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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