| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device which achieves excellent heat radiation performance and reduces the size and thickness thereof. <P>SOLUTION: An electronic device of this invention includes: an insulation substrate 10; a power amplifier 20 mounted on an upper surface of the insulation substrate 10 through a flip chip mounting method; a sealing member 22 which is provided on the insulation substrate, seals the power amplifier 20, and has higher heat conductivity than the power amplifier 20; and via wiring 16c which penetrates through the insulation substrate 10, contacts with the sealing member 22, and has higher heat conductivity than the insulation substrate 10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
