| 摘要 |
A cooling device operating method which is capable of reducing power consumption of the cooling device used in an inspection apparatus. The method controls a cooling device which cools a wafer chuck on which a semiconductor wafer is loaded. The temperature of the wafer chuck is controllable through the cooling device and a heating device. Low temperature and high temperature inspections of the wafer can be performed under control of the controller, and the cooling device is continuously run through control of the controller for the low temperature inspection while it is stopped at least one time at the start of the high temperature inspection through the controller for the high temperature inspection. |
