SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A semiconductor device (10) according to one embodiment of the present invention is provided with: a semiconductor chip (14); a die pad (12) that has a chip mounting surface (12a) on which the semiconductor chip is mounted; first leads (18, 20) that are electrically connected to the semiconductor chip; a thermosetting resin portion (22) that affixes end portions (18A, 20A) of the first leads to the die pad; and a thermoplastic resin portion (24) that encapsulates the semiconductor chip, the die pad and the thermosetting resin portion.