| 摘要 |
Systems and methods of testing semiconductor devices, the system including a tester configured to evaluate electrical characteristics of a semiconductor device provided on a wafer, and a probe unit configured to transfer electrical signals used to test the semiconductor device between the tester and the semiconductor device. The probe unit may include: a housing; a wafer supporting member disposed in the housing to support the wafer; a printed circuit board disposed on the housing to transfer the electrical signals from and to the tester, and a probe card disposed opposite the wafer supporting member, in the housing. The probe card may include probe pins to deliver the electrical signal from and to the semiconductor device. Each of the probe pins may include a probe tip configured to adjustably extend to contact the wafer. |
