发明名称 CONDUCTIVE METAL PASTE COMPOSITION AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide: a conductive metal paste composition containing a conductive metal particle including a first metal particle, which has a particle size of less than 100 nm and whose surface is coated with a capping material, and a second metal particle of 100 nm or more, a binder, and a solvent; a manufacturing method thereof; and an electrode of an electron element and a conductive circuit using it. <P>SOLUTION: In a paste composition containing two or more kinds of conductive metal particles with different particle sizes, more excellent conductivity than that of existing metal paste is secured in low-temperature sintering or intermediate- or high-temperature sintering in a short time. Thereby, a large amount of conductive paste materials can be manufactured by coupling such a dispersion nano particle with a conductive metal particle with a large size, so as to improve a sintering characteristic at various temperatures. Also, the conductive metal paste composition can be used for various electron elements. A thus-formed electrode and a pattern of a conductive circuit can minimize failures such as short circuit, disconnection, and cracks. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012182111(A) 申请公布日期 2012.09.20
申请号 JP20110271046 申请日期 2011.12.12
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 CHEONG BYUN-HO;KIM DON-HUN;CHE SUN HAN;CHE JON-MIN
分类号 H01B1/22;B22F1/00;B22F1/02;H01B1/00;H01B5/14;H01B13/00;H05K1/09 主分类号 H01B1/22
代理机构 代理人
主权项
地址