SUBSTRATE PROCESSING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CEILING HEAT INSULATOR, AND HEATER

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus, a semiconductor device manufacturing method, and a ceiling heat insulator, capable of reducing generation of cracks in the ceiling heat insulator, break of the ceiling heat insulator, and risk of fall of the ceiling heat insulator.

SOLUTION: A substrate processing apparatus comprises a heater 206 provided outside a reaction container for processing substrates. The heater 206 comprises: a cylindrical sidewall heat insulator 12; a ceiling heat insulator 16 placed on the sidewall heat insulator 12; and a heat generator 14 provided inside the sidewall heat insulator 12. In the ceiling heat insulator 16 of the heater 206, a plurality of stress releasing portions is disposed from the center of the ceiling heat insulator 16 to the periphery.

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