| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame, a semiconductor device manufacturing method, and a semiconductor device, which can fixedly hold a resin encapsulated package by using a lead frame having a notch provided with a step part in a plate thickness direction. <P>SOLUTION: A lead frame of the present invention comprises a die pad, inner leads, outer leads, tie bars, and an outer frame. A notch is provided on the outer frame and provided with a notched step part. The notch is filled with a resin from a resin encapsulated package in resin molding, and thereby the resin encapsulated package can be fixed to the lead frame. Further, a semiconductor device is manufactured by using this lead frame. <P>COPYRIGHT: (C)2012,JPO&INPIT |
