HIGH THERMAL CONDUCTIVITY/LOW COEFFICIENT OF THERMAL EXPANSION COMPOSITES
摘要
A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.
申请公布号
WO2012125817(A1)
申请公布日期
2012.09.20
申请号
WO2012US29215
申请日期
2012.03.15
申请人
MOMENTIVE PERFORMANCE MATERIALS, INC.;FAN, WEI;LIU, XIANG;MARINER, JOHN