METHOD FOR IMPARTING EMBOSSED SHAPES TO ACRYLIC RESIN FILM

摘要

Disclosed is a method for imparting an embossed shape to an acrylic resin film by an embossing die at a temperature T[°C] represented by the following formula (1), wherein the storage modulus (E') under a measurement frequency of 0.1 Hz of the acrylic resin film at the temperature T[°C] is 0.20 to 0.36 Mpa and the elongation at break under the following evaluation method is 100% or more:
(T D : heat distortion temperature of acrylic resin film)

Test specimen: film-form material having a thickness of 50 µm and a width of 15 mm
Tensile test conditions: initial chuck-to-chuck distance: 50 mm, tensile speed: 500 mm/min, temperature: 23°C;
an embossed shape-imparting property, a film handling property and a die-release property being excellent in this method.