INK ABSORBING LAYER, INK ABSORBING LAYER FORMING APPLICATION LIQUID, METHOD OF FORMING INK ABSORBING LAYER, AND METHOD FOR FORMING CONDUCTIVE PATTERN

摘要

PROBLEM TO BE SOLVED: To provide a method of forming an ink absorbing layer on a substrate which enables a conductive pattern to be formed with satisfactory conductivity and substrate adhesion.

SOLUTION: The ink absorbing layer formed on a substrate surface, on which a conductive ink containing a copper particle can be applied and fired to form a conductive pattern, is (i) an ink absorbing layer (R1) in which a structure comprising a nonconductive inorganic particle and a binder resin holds 5-25 mass% of polyol, (ii) an ink absorbing layer (R2) in which a nonconductive inorganic material structure having a porous structure section with a plurality of through holes holds 5-80 volume% of polyol, or (iii) an ink absorbing layer (R3) in which a nonconductive organic polymer structure having a porous structure section with a plurality of through holes holds 5-80 volume% of polyol, and the polyol has two or more hydroxyl groups in the molecule and has an atmospheric boiling point of 100-350°C.

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