SOLDER HEIGHT DETECTION METHOD AND SOLDER HEIGHT DETECTION DEVICE

摘要

A solder height detection method that detects the height of a solder printed on a substrate and includes: an image acquisition step (S201) that obtains a two-dimensional image of the substrate taken from the surface side on which the solder has been printed; and a height detection step (S203) that detects the solder height corresponding to a pixel value for pixels configuring the two-dimensional image, on the basis of height information indicating the correspondence between the solder height and the pixel value, which is a value indicating at least one of either the luminance of red, green, and blue displayed by an RGB color model or the hue, saturation, and intensity indicated by an HIS color model.