| 摘要 |
<p>Disclosed is a microchannel cooler for an integrated circuit chip (20) comprising an integrated circuit chip (20) and a microchannel cooler located on the surface of the integrated circuit chip (20), with the microchannel cooler being a carbon nanotube array (14) bonded on the surface of the integrated circuit chip (20), the carbon nanotube array (14) being sealed off by a sealing cap (21), a plurality of microchannels being provided in the carbon nanotube array (14), and an inlet and an outlet for a cooling fluid being provided at two ends of the sealing cap (21). Also disclosed is a method for manufacturing the cooler, which method includes the step of growing carbon nanotubes on a silicon substrate (10), the step of mounting the carbon nanotubes in an inverted manner to the surface of the integrated circuit chip (20), and the step of sealing the carbon nanotubes. Because the microchannels are formed by the carbon nanotubes, and the carbon nanotubes are directly bonded to the surface of the integrated circuit chip (20), the efficiency of heat dissipation is improved, and this affects the overall height of the integrated circuit chip (20) very little, thereby being advantageous for improving the level of integration and for reducing the overall external appearance of height.</p> |
