Method for checking e.g. electrical errors in multi-layer arrangements in electronic modules, involves performing thermal radiation measurement at regions of arrangements and temporarily correlating measurement to electrical current signal

摘要

The method involves introducing temporarily and/or partially a cyclically repetitive electrical current signal e.g. sinusoidal current signal, in regions (8-10, 14) of a multi-layer arrangement of an electronic module (6) to be checked. Thermal radiation measurement is performed at the regions of the multi-layer arrangements and temporarily correlated to the signal. The thermal radiation measurement is temporarily and/or partial quasi-punctiformly, temporarily and/or partial quasi-linearly and temporarily and/or partial two-dimensionally performed. The multi-layer arrangement of the electronic modules comprises a base plate (13) and a substrate (12), which is designed as a directly plated-copper substrate, an insulated metal substrate, a directly plated-aluminum substrate and/or a printed circuit board. An independent claim is also included for a thermography device for checking multi-layer arrangements in electronic modules.