DICING/DIE BONDING SHEET AND METHOD FOR PROCESSING SAPPHIRE SUBSTRATE FOR LED

摘要

PROBLEM TO BE SOLVED: To provide a dicing/die bonding sheet which has good pickup properties for a long period of time, and to provide a method for processing a sapphire substrate for an LED using the same.

SOLUTION: In a dicing/die bonding sheet 10, an adhesive layer 12b and a bonding agent layer 13 are formed in this order on a base film 12a. In the dicing/die bonding sheet 10, the adhesive layer 12b is made of a phenyl-based silicone adhesive containing a phenyl group, and the bonding agent layer 13 is made of an addition reaction type silicone bonding agent containing no phenyl group.

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