| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a printed circuit board or the like, excellent in both of heat resistance and adhesiveness without using a halogen-based or phosphorus-based flame retarder. <P>SOLUTION: The epoxy resin composition contains an epoxy resin (A) and a curing agent (B) for an epoxy resin. The curing agent (B) for an epoxy resin contains a phenolic resin (F), which contains at least one of a structural unit X expressed by a predetermined general formula, obtained by reacting a biphenyl isomer or a mixture of biphenyl isomers with a phenolic compound and a structural unit Y expressed by a predetermined general formula obtained by reacting a benzene isomer or a mixture of benzene isomers with a phenolic compound, with the sum of the repetition number of the structural unit X and the repetition number of the structural unit Y (n or m+m') being larger than 10 and smaller than 75. <P>COPYRIGHT: (C)2012,JPO&INPIT |
