发明名称 |
PHASE-CHANGE MEMORY DEVICE AND MANUFACTURING METHOD AT THE SAME |
摘要 |
<p>PURPOSE: A phase change memory device and a manufacturing method thereof are provided to have an etch stop layer including a metal oxide layer which an etch selection ratio is higher than the ratio of a metal nitride layer of a lower portion electrode, thereby minimizing damage of the lower portion electrode, when a knoll structure is formed. CONSTITUTION: A mold oxide layer is formed on a substrate. A lower portion electrode(30) is formed on the mold oxide layer. The lower portion electrode is connected to the substrate. A knoll structure(40) covers a part of the lower portion electrode. The knoll structure includes an etch stop layer(42) and a knoll insulation layer. A phase change layer covers the rest of the lower portion electrode exposed from the knoll structure. The etch stop layer includes a material which is a high etch selection ratio for the lower portion electrode.</p> |
申请公布号 |
KR20120104040(A) |
申请公布日期 |
2012.09.20 |
申请号 |
KR20110022107 |
申请日期 |
2011.03.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, KYU SUL;OH, JAE HEE;JOO, HEUNG JIN |
分类号 |
H01L27/115;H01L21/8247 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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