发明名称 RESIN COMPOSITION FOR SEALING MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a transparent resin composition for a sealing material which has excellent adhesion and is excellent in processability, heat resistance, and light resistance when performing treatments of melting, processing or the like. <P>SOLUTION: The transparent resin composition for a sealing material including: (A) a polyolefin resin; and (B) a hydride of a C9-based aromatic hydrocarbon resin having the hydrogenation rate of at least 80% is used. Desirably, (B) the hydride of the C9-based aromatic hydrocarbon resin having the hydrogenation rate of at least 80% is such that the softening point is 70-150&deg;C, the weight average molecular weight is 800-3.000, and is polymerized by using a non-phenol based Friedel-Crafts catalyst. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012180465(A) 申请公布日期 2012.09.20
申请号 JP20110044708 申请日期 2011.03.02
申请人 ARAKAWA CHEM IND CO LTD 发明人 NAKAMOTO CHU
分类号 C08L23/00;C08L25/16 主分类号 C08L23/00
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