| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve an effect of electromagnetic shielding to wiring. <P>SOLUTION: On an upper surface of a substrate material 20, a pair of power supply wirings 14a, 14b having terminals T to be connected to another electric components, and at least one pair of differential wirings 15a, 15b, 16a, 16b having terminals T to be connected to another electric components are disposed. At one end portion of the substrate material 20, a first ground pattern 21 is disposed on the upper surface of the substrate material 20 so as to surround both terminals T of the pair of the power supply wirings 14a, 14b, and to surround the terminals T of the pair of the differential wirings. A second ground pattern 22 is disposed on a lower surface of the substrate material 20 so as to overlap the power supply wirings 14a, 14b and the differential wirings 15a, 15b, 16a, 16b on the upper surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
