发明名称 |
LIGHT EMITTING DIODE PACKAGE |
摘要 |
A light emitting diode package comprises a light emitting diode chip, a first luminescent conversion layer and a separate second luminescent conversion layer on the first luminescent conversion layer. The first luminescent conversion layer has a first luminescent conversion element surrounding the light emitting diode chip. The second luminescent conversion layer has a second luminescent conversion element located above the light emitting diode chip. An excitation efficiency of the first luminescent conversion element is higher than that of the second luminescent conversion element.
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申请公布号 |
US2012235192(A1) |
申请公布日期 |
2012.09.20 |
申请号 |
US201113288038 |
申请日期 |
2011.11.03 |
申请人 |
LIN HSIN-CHIANG;TSENG WEN-LIANG;CHANG CHIEH-LING;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
LIN HSIN-CHIANG;TSENG WEN-LIANG;CHANG CHIEH-LING |
分类号 |
H01L33/60 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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