| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a semiconductor device with high precision and, in particular, to provide and manufacture a solid-state imaging device with high image quality. <P>SOLUTION: In an imaging region 103 and a peripheral region 104 of a semiconductor substrate 101, a first waveguide member 118 and a via plug penetrating through the first waveguide member 118 are provided. <P>COPYRIGHT: (C)2012,JPO&INPIT |
