发明名称 PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a package which has a large current capacity, suppresses occurrence of cracks due to decrease in stress generated, and has high reliability. <P>SOLUTION: There is provided a package comprising: a package outer wall 16; a through hole penetrating through the package outer wall 16; a convex feedthrough 25 fit in the through hole; and a terminal electrode 21b fixed to the convex feedthrough 25. The terminal electrode 21b includes a first metal layer 90, which has a relatively low coefficient of linear thermal expansion and a relatively high resistivity, and second metal layers 80a, 80b which has a relatively high coefficient of linear thermal expansion and a relatively low resistivity. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012182386(A) 申请公布日期 2012.09.20
申请号 JP20110045521 申请日期 2011.03.02
申请人 TOSHIBA CORP 发明人 TAKAGI KAZUTAKA
分类号 H01L23/04;H01L21/338;H01L29/778;H01L29/812 主分类号 H01L23/04
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