| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the deterioration of heat radiation performance for heat generated from a bare chip and prevent peeling and cracks caused when a heat sink is embedded in a sealing resin so as to be exposed in order to improve the heat radiation. <P>SOLUTION: In an electronic circuit device, an electronic circuit assembly for controlling a transmission and a driving machine of a vehicle, a base to which the electronic circuit assembly is fixed, and a lead terminal electrically connecting with the electronic circuit assembly are sealed with a mold resin. In the electronic circuit device, a heat radiation structure is formed so that an opening penetrating through a circuit board and the base is provided at a lower part of a heating circuit element (bare chip) and both surfaces of the heating circuit element thermally connect with a sealing resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
