METHOD FOR MANUFACTURING LEAD FRAME SUBSTRATE FOR LED ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a lead frame substrate for an LED element capable of suppressing an adverse effect of resin burrs in a pad part and an electrical connection area.

SOLUTION: A method for manufacturing a lead frame substrate 1 for an LED element comprising a frame part 10 having a pad part 11 on which the LED element is mounted and a connection area 12 electrically connected to the LED element mounted on the pad part via wire; and a resin part having a reflector part surrounding the pad part and the connection area in plan view and attached to the frame part; comprises an etching step for forming the frame part by forming the pad part and the connection area on a metal plate 30; a plating treatment step for forming a plating layer on the pad part and the connection area after the etching step; a resin part forming step for forming a resin part on the frame part after the plating treatment step; and a resin removing step for removing the resin existing on the pad part and the connection area after the resin part forming step.

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