| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a hot melt adhesive applicable at low temperature, having high heat resistance. <P>SOLUTION: The hot melt adhesive applicable at low temperature includes: 20-40 wt.% of a polymer blend (a) that contains an n-butylacrylate copolymer (i) comprising 15-35 wt.% of n-butylacrylate and an ethylene-vinylacetate copolymer (ii) comprising 10-45 wt.% of vinylacetate; 25-45 wt.% of a tackifier resin (b) having a softening point of 90-120°C; and 25-45 wt.% of a wax (c) having a melting point of 54-77°C, wherein the adhesive is based on the total weight of the wt.% (percent by weight). The adhesive has viscosity from 0.8 to 1.5 Pa s at adhesive-applying temperature of ≤121°C, wherein the heat stress value of the linked adhesive and the adhesive-applying temperature, shown by temperature at which stressed linking is broken, are separated by only 38°C(100°F). <P>COPYRIGHT: (C)2012,JPO&INPIT |
