| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an improved loading apparatus for loading planar thin semiconductor substrates in a cover boat in a vertical furnace. <P>SOLUTION: A wafer boat assembly is provided for use in a loading apparatus for loading semiconductor substrates in a vertical furnace configured for batch processing. The wafer boat assembly comprises a wafer boat for holding semiconductor substrates, and a cover configured to substantially surround the substrates. The wafer boat assembly is provided with: a first wafer boat part comprising a base and a first cover part mounted to the base, the first cover part extending at least partially along a base upper perimeter; and a second wafer boat part comprising a second cover part removably provided on the first wafer boat part and configured to cooperate with the first cover part, the second cover part comprising receiving slots for receiving at least one semiconductor substrate to be processed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
