| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ink material and an ink which can be dried at low temperatures and is excellent in heat resistance, little affected by thermal shrinkage due to drying, and suitable for a cover lay film. <P>SOLUTION: A polyamide-imide powder is synthesized from trimellitic anhydride acid chloride, high molecular weight modified silicone oil having amino groups at both terminals, and bis[4-(3-aminophenoxy)phenyl] sulfone. When the polyamide-imide powder is dissolved as the ink material in an organic solvent, an ink, which can be dried at low temperatures and is excellent in heat resistance, little affected by thermal shrinkage caused by drying, and suitable for a cover lay film, is obtained. <P>COPYRIGHT: (C)2012,JPO&INPIT |
