ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent a sealing layer from intruding into a function part and form a space where the function part operates without increasing the size of an electronic component in the electronic component where a function element having the function part is mounted on a wiring board and a sealing layer is provided for protecting at least a joining part between the wiring board and the function element.

SOLUTION: An electronic component is formed so that a water-repellent layer is formed at a region facing a function part of a function element on a main surface of a wiring board. The structure inhibits a component resin from flowing into a space between a main surface of the wiring board and a function part of the function element when a sealing resin is formed and forms a space for operating the function part therebetween.

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