发明名称 ALLOY FOR LIQUID-PHASE DIFFUSION BONDING
摘要 <P>PROBLEM TO BE SOLVED: To provide an alloy for liquid-phase diffusion bonding, which can improve joining portion quality after liquid-phase diffusion bonding by optimizing the alloy composition of a joining material. <P>SOLUTION: The alloy for liquid-phase diffusion bonding contains, by atom%, 10-60% Ni, 1-20% Co, 10- 22% B, 0.01- 10% in total of one or both of W and Mo, and the balance consisting of Fe and inevitable impurities. Further, the alloy for liquid-phase diffusion bonding contains at least one of 0.1-20% Cr and 0.1-10% V. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012179640(A) 申请公布日期 2012.09.20
申请号 JP20110044694 申请日期 2011.03.02
申请人 NIPPON STEEL CORP 发明人 SATO YUICHI;HASEGAWA HIROSHI
分类号 B23K35/30;B23K20/00;C22C19/03;C22C30/00 主分类号 B23K35/30
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