发明名称 |
DEBONDER TO MANUFACTURE SEMICONDUCTOR AND DEBONDING METHOD THEREOF |
摘要 |
A debonder to manufacture a semiconductor that includes: a stage to support a carrier wafer that is attached to a chip stack assembly by a temporary adhesive layer coated on the surface of the carrier wafer; a chuck arranged above the stage to selectively secure the chip stack assembly; a lifting unit to lift the chuck from the stage; a lateral driving unit to move the chuck laterally with respect to the stage; and a controller to control the lifting unit and the lateral driving unit.
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申请公布号 |
US2012234497(A1) |
申请公布日期 |
2012.09.20 |
申请号 |
US201213418795 |
申请日期 |
2012.03.13 |
申请人 |
HAN IL YOUNG;SONG HO GEON;PARK SANG WOOK;HONG JI-SEOK;SAMSUNG ELECTRONICS CO., LTD |
发明人 |
HAN IL YOUNG;SONG HO GEON;PARK SANG WOOK;HONG JI-SEOK |
分类号 |
B32B38/10 |
主分类号 |
B32B38/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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