发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME |
摘要 |
A semiconductor package and a method of fabricating the same. The semiconductor package includes: a substrate having a plurality of semiconductor components disposed thereon; an encapsulant covering the substrate and the semiconductor components; and a metal layer formed on the exposed surfaces of the encapsulant, wherein the encapsulant is formed with a trench for dividing into a plurality of package units on the substrate to allow each of the package units to have at least one of the semiconductor components, and the metal layer is formed in the trench to encompass the encapsulant on the periphery of the semiconductor components, thereby preventing interference of electromagnetic waves between the semiconductor components.
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申请公布号 |
US2012235259(A1) |
申请公布日期 |
2012.09.20 |
申请号 |
US201113242182 |
申请日期 |
2011.09.23 |
申请人 |
FANG HAO-JU;CHUNG HSIN-LUNG;CHANG CHO-HSIN;TSAI TSUNG-HSIEN;SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
FANG HAO-JU;CHUNG HSIN-LUNG;CHANG CHO-HSIN;TSAI TSUNG-HSIEN |
分类号 |
H01L31/0203;H01L31/18 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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