VAPOR DEPOSITION APPARATUS, VAPOR DEPOSITION METHOD, AND ORGANIC EL DISPLAY

摘要

A vapor deposition apparatus is provided with: an evaporation source (60) provided with a plurality of evaporation source openings (61) for discharging deposition particles (91); a restriction unit (80) provided with a plurality of restriction openings (82); and a deposition mask (70) in which a plurality of mask openings (71) are formed only in a plurality of deposition regions (72) where deposition particles that have passed through the plurality of restriction openings reach. The plurality of deposition regions are positioned in the normal direction of a substrate (10) and in a second direction orthogonal to the direction in which the substrate moves so as to sandwich non-deposition regions (73) where deposition particles do not reach. When viewed in the normal direction of the substrate, the mask openings, through which deposition particles pass, are formed at different positions in the direction in which the substrate moves, relative to the non-deposition regions on lines parallel to the second direction. This configuration enables a vapor deposition coating with minimally-blurred edges to be stably formed at desired positions on the substrate.