| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper alloy sheet which has a high Young's modulus and excellent strength, and is suited to electrical/electronic device lead frames, connectors, terminals and the like, and to in-vehicle connectors or terminals, relays or switches, etc., and a method for manufacturing the same. <P>SOLUTION: The sheet has an alloy composition which contains 0.03 to 5.0 mass% of one, two or three among Ni, Fe and Sn, and 0.01 to 0.3 mass% of P with the remainder being copper and unavoidable impurities; under the crystal orientation analysis by means of EBSD, in relation to the accumulation in the atomic plane facing in the width direction (TD) of a rolled sheet, the surface area ratio of a region having an atomic plane wherein the angle formed by the TD and a normal line of a (111) plane is not greater than 20° is at least 50%. The manufacturing method is also provided. <P>COPYRIGHT: (C)2012,JPO&INPIT |
