ELECTRONIC CIRCUIT, AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide an electronic circuit capable of bonding a bump formed on a substrate surface of an integrated circuit substrate performing signal processing of a high-frequency signal with an electrode terminal of the integrated circuit substrate while separating the integrated circuit substrate and a wiring substrate from each other by a predetermined distance with ease and with high accuracy.

SOLUTION: An electronic circuit has: an integrated circuit substrate 21 having a signal processing circuit performing signal processing of a high-frequency signal having a wavelength equal to or less than a millimeter unit, and in which a bump 23 is formed on a first electrode terminal 22 provided on a substrate surface 21a; and a wiring substrate 11 on which a second electrode terminal 12 bonded with the bump 23 formed on the integrated circuit substrate 21 is formed. On the wiring substrate 11, insulating resin spacers 13a for separating the wiring substrate 11 from the integrated circuit substrate 21 by a predetermined distance are formed at three or more positions not superposed with a circuit pattern of the signal processing circuit of the integrated circuit substrate 21 and not provided on the same straight line on a substrate surface 11a of the wiring substrate 11.

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