| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus, such as an etching semiconductor apparatus operable to etch a silicon nitride film, which enables a longer service life of phosphoric acid solution by preventing the reduction in the moisture density, and keeping a boiling power for a longer time. <P>SOLUTION: The semiconductor manufacturing apparatus comprises at least two rows of protruding structures 8 and 9 arrayed on a peripheral portion of a lid 1 on the inner side thereof and opposed to an etchant 3. The number of the arrays is two, for example. The arrayed structures are arranged in zigzag generally, and form a first array composed of an outer array on the inner side of the lid 1, and a second array composed of an inner array. The space (A) between adjacent protruding structures 8 of the first array is equal to or shorter than the length (B) of the protruding structure 9 of the second array corresponding to the space (A)(A≤B). In the semiconductor manufacturing apparatus, the pressure in an etching tank never rises to a level higher than required, and no moisture content flows outside the etching tank. <P>COPYRIGHT: (C)2012,JPO&INPIT |
