CURABLE RESIN COMPOSITION, CURED MATERIAL OF THE SAME AND VARIOUS ARTICLES DERIVED FROM THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a curable composition comprising a silsesquioxane compound that removes defects of extremely poor stability of a conventional silsesquioxane containing a residual alkoxy group and a curable composition containing the same, is cured by ultraviolet light and contains substantially no silanol group.

SOLUTION: The curable resin composition includes an epoxy group-containing silsesquioxane (A) containing substantially no silanol group obtained by hydrolyzing a mixture containing an epoxy group-containing alkoxysilane (a1) represented by general formula (1): R1Si(OR2)3(wherein R1is a 1-8C hydrocarbon group containing at least one epoxy group or an aromatic hydrocarbon group containing at least one epoxy group; R2is a hydrogen atom, a 1-8C hydrocarbon group or an aromatic hydrocarbon group) and a metal alkoxide (a2) containing no epoxy group in the molar ratio of änumber of moles of (a2)/total of number of moles of (a1) and number of moles of (a2)} of ≤0.8 using a solid catalyst and condensing the resulting product and a curing agent (B) for an epoxy resin as essential components.

COPYRIGHT: (C)2012,JPO&INPIT