LED MODULE AND ITS MANUFACTURING METHOD

摘要

PURPOSE: A light emitting diode module and a manufacturing method thereof are provided to close penetration pin holes of a circuit substrate with a part of a molding cover, thereby preventing moisture caused by the pin holes of the circuit substrate or penetration of external air. CONSTITUTION: A circuit substrate(2) includes a light emitting diode mounted area in an upper side of the circuit substrate. Pin holes(21) of up and down penetration type are formed in the circuit substrate. A light emitting diode is mounted in the light emitting diode mounted area. A molding cover(3) is performed a molding operation for covering the upper side and a lower side of the circuit substrate. A part of the molding cover fills a part of the pin holes. The molding cover includes a cavity formed in the upper side of the light emitting diode mounted area.