| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of fixing a component at a prescribed position using a scrubbing operation without displacement, and a semiconductor device. <P>SOLUTION: A manufacturing method of a semiconductor device comprises: a step of sucking a first flat plate-like component to a suction collet; a step of disposing an adhesive metal on a top face of a second flat plate-like component; a step of placing the first component on the adhesive metal by moving the suction collet with the first component being sucked; and a step of fixing the first component at the second component via the adhesive metal by performing a scrubbing operation for the suction collet only in the direction in which a distance between the first component and the second component increases or decreases with the first component being in contact with the suction collet. <P>COPYRIGHT: (C)2012,JPO&INPIT |
