| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently and safely join substrates in a uniform condition over the entire surfaces. <P>SOLUTION: A joining apparatus joins a pair of substrates and includes: a position control part which detects a position of one substrate and regulates the movements of the one substrate in a direction that the one substrate moves close to the other substrate and in a direction that the one substrate moves away from the other substrate based on the detected position; a proximity detection part which detects that the pair of substrates are positioned close to each other with a clearance, which is smaller than a clearance having a predetermined dimension, formed therebetween or the pair of substrates are in contact with each other; and a pressure control part which detects a pressure acting between the pair of substrates after the proximity detection part detects the proximity or the contact of the pair of substrates and pressurizes the one substrate toward the other substrate until the pressure reaches a given target pressure. <P>COPYRIGHT: (C)2012,JPO&INPIT |
