| 摘要 |
An epoxy resin composition and an epoxy resin molding material for sealing semiconductor are provided, the epoxy resin molding material containing the epoxy resin composition, the epoxy resin composition and the epoxy resin molding material achieving a good balance among heat resistance, peeling resistance, thermal shock resistance, moisture resistance reliability, and internal-stress relaxation. The present invention relates to an epoxy resin composition (C) for sealing semiconductor includes an epoxy resin (A) and a core-shell polymer (B) containing at least one rubber layer, at least 70% of the core-shell polymer (B) being dispersed in the form of primary particles in a resin phase containing the epoxy resin, and the content of alkali metal ions in the epoxy resin composition (C) being 30 ppm or less. An epoxy resin molding material containing the epoxy resin composition (C) is also provided. |
