发明名称 Passive, Low-Profile Heat Transferring System
摘要 A media content receiving device, such as a set top box, includes a thermally conductive chassis having at least one panel with opposing surfaces. One of the opposing surfaces is exposed to an ambient environment. A circuit board located within the chassis includes at least one integrated circuit chip. A thermally conductive heat transferring unit is bonded to and in thermal conductive contact with the chip. The heat transferring unit is arranged to transfer heat from the chip to the at least one panel of the chassis while minimizing radiant heat transfer proximate the chip. The heat transferring unit may be biased toward the panel.
申请公布号 EP2501211(A1) 申请公布日期 2012.09.19
申请号 EP20120157866 申请日期 2012.03.02
申请人 ELDON TECHNOLOGY LIMITED 发明人 STEPHENS, MATTHEW;TAILOR, BHAVESH;MARLOW, STEWART;LEGG, ROBERT
分类号 H05K7/20 主分类号 H05K7/20
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