| 摘要 |
A semiconductor device may include a semiconductor chip including a signal terminating resistor coupled between a signal input pad and a first ground voltage pad, a semiconductor package including a signal input terminal and a first ground voltage terminal, the signal input terminal being electrically coupled to the signal input pad of the semiconductor chip and the first ground voltage terminal being electrically coupled to the first ground voltage pad of the semiconductor chip, a capacitor and a resistor that are coupled between the signal input terminal and the first ground voltage terminal, and a first inductor realized by coupling the signal input terminal and the signal input pad. |
